Platen with debris control for chemical mechanical planarization
US6659849B1 · kind B1 · utility
3Cited by
16References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | Dec 9, 2003 |
| Priority date | — |
| Expiry date | Nov 3, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Generally, a method and apparatus for cleaning a backside of a web of polishing material. In one embodiment, the apparatus includes a platen having a support surface adapted to support the backside the web and a web cleaner disposed on the platen and adjacent the backside of the web. A method for cleaning a web of polishing material is also provided. In one embodiment, the method includes the steps of supporting a portion of the web of polishing media on a platen, advancing a portion of the web onto the platen, and cleaning the unrolled portion of the web.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.