Lid assembly for a processing system to facilitate sequential deposition techniques

US6660126B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Anh N. Nguyen · Milpitas, US
• Michael Yang · Fremont, US
• Ming Xi · Palo Alto, US
• Hua Chung · San Jose, US
• Anzhong Chang · San Jose, US
• Xiaoxiong Yuan · Cupertino, US
• Siqing Lu · Sunnyvale, US

Key dates

• Filing date: Mar 2, 2001
• Grant date: Dec 9, 2003
• Expiry date: Aug 25, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67017
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A lid for a semiconductor system, an exemplary embodiment of which includes a support having opposed first and second opposed surfaces. A valve is coupled to the first surface. A baffle plate is mounted to the second surface. The valve is coupled to the support to direct a flow of fluid along a path in original direction and at an injection velocity. The baffle plate is disposed in the path to disperse the flow of fluid in a plane extending transversely to the original direction. In one embodiment the valve is mounted to a W-seal that is in turn mounted to the first surface of the support.