Substrate processing apparatus and substrate processing method
US6672779B2 · kind B2 · utility
24Cited by
13References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2002 |
| Grant date | Jan 6, 2004 |
| Priority date | — |
| Expiry date | Sep 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.