Wafer processing apparatus and a wafer stage and a wafer processing method
US6677167B2 · kind B2 · utility
16Cited by
12References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Mar 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing apparatus comprising a wafer stage, wherein a semiconductor wafer is mounted on the wafer stage so as to process the semiconductor wafer, wherein a holding mechanism of the wafer stage is commonly used for a plurality of wafer stages, and accordingly, the wafer stage can be changed into a wafer stage having a different function so as to process the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.