Structure and method of forming a multiple leadframe semiconductor device
US6677672B2 · kind B2 · utility
20Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device (20) has a first leadframe (200) with a first semiconductor die (70) electrically coupled to one of its leads. A second semiconductor die (130) is mounted to a second leadframe (300) that has a first lead (35, 150) electrically coupled to the second semiconductor die and a second lead (30, 35) mounted to the lead of the first leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.