Patent · US Expired

Electronic component and process for producing the electronic component

US6683374B2 · kind B2 · utility

15Cited by

7References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Bernd Goller · Otterfing, DE
Robert-Christian Hagen · Sarching, DE
Gerald Ofner · Regensburg, DE
Christian Stumpfl · Wels, AT
Josef Thumbs · Johanngeorgenstadt, DE
Stefan Wein · Regensburg, DE
Holger Wörner · Regensburg, DE

Key dates

Filing date	Aug 30, 2002
Grant date	Jan 27, 2004
Priority date	—
Expiry date	Aug 30, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/01322
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.