Tamper-responding encapsulated enclosure having flexible protective mesh structure
US6686539B2 · kind B2 · utility
89Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2001 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Apr 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.