In-situ metalization monitoring using eddy current and optical measurements
US6707540B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2000 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Sep 29, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/72
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample. The CMP system includes a polishing table, a sample carrier arranged to hold the sample over the polishing table, and an eddy probe. The polishing table and sample carrier are arranged to receive a polishing agent between the sample and the polishing table and to polish the sample by moving the polishing table and the sample carrier relative to each other. The eddy probe is arranged to be operable to obtain a measurement of the sample while the sample is being polished. The CMP system further includes an optical measurement device arranged to be operable to obtain a measurement of the sample while the sample is being polished. The CMP system also has a memory and a processor coupled with the memory. The processor and memory are adapted for operating the eddy probe and optical measurement device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.