Method and apparatus for utilizing integrated metrology data as feed-forward data
US6708075B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2001 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Jan 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus for performing feed-forward correction during semiconductor wafer manufacturing. A first process on a semiconductor wafer is performed. Integrated metrology data related to the first process of the semiconductor wafer is acquired. An integrated metrology feed-forward process is performed based upon the integrated metrology data, the integrated metrology feed-forward process comprising identifying at least one error on the semiconductor wafer based upon the integrated metrology data related to the first process of the semiconductor wafer and performing an adjustment process to a second process to be performed on the wafer to compensate for the error. The second process on the semiconductor wafer is performed based upon the adjustment process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.