Patent · US Expired

Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component

US6710455B2 · kind B2 · utility

30Cited by

9References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Bernd Goller · Otterfing, DE
Gerald Ofner · Regensburg, DE
Josef Thumbs · Johanngeorgenstadt, DE
Holger Wörner · Regensburg, DE
Robert-Christian Hagen · Sarching, DE
Christian Stumpfl · Wels, AT
Stefan Wein · Regensburg, DE

Key dates

Filing date	Aug 30, 2002
Grant date	Mar 23, 2004
Priority date	—
Expiry date	Aug 30, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.