System for cleaning a semiconductor wafer
US6711775B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 1999 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Jun 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67046
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and a system are provided for cleaning a surface of a wafer. The method starts by scrubbing the surface of the wafer with a cleaning brush that applies a chemical solution to the surface of the wafer. In one example, the cleaning brush implements a through the brush (TTB) technique to apply the chemicals. The scrubbing is generally performed in a brush box, with a top cleaning brush and a bottom cleaning brush. The top cleaning brush is then removed from contact with the surface of the wafer. The chemical concentration in the top brush may be maintained at substantially the same concentration that was in the brush during the scrubbing operation. Next, a flow of water (preferably de-ionized water) is delivered to the surface of the wafer. The delivery of water is preferably configured to remove substantially all of the chemical solution from the surface of the wafer before proceeding to a next cleaning operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.