Semiconductor device and laminated leadframe package
US6713317B2 · kind B2 · utility
19Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Aug 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor device (100) by attaching a top surface of a first laminate (630) to a bottom surface of a second laminate (650) to form a leadframe (620) and mounting a semiconductor die (102) to the leadframe to form the semiconductor device. The first semiconductor die is encapsulated with a molding compound (108) and material is removed from the first laminate to form a mold lock (120) with the molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.