Die corner alignment structure

US6724096B2 · kind B2 · utility

Assignee

• Advanced Micro Devices, Inc. · US

Inventors

• Thomas Werner · Radebeul, DE
• Gunter Grasshoff · Radebeul, DE
• Bernd Schulz · Radebeul, DE
• Carsten Hartig · Meerane, DE

Key dates

• Filing date: Apr 16, 2002
• Grant date: Apr 20, 2004
• Expiry date: Aug 9, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/975
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor device structure comprises a corner structure enclosed by a delineation region, wherein the shape of the corner structure does not exhibit any symmetry with respect to point symmetry and axial symmetry, such that the corner structure is unambiguously recognizable by an automated alignment system. Furthermore, the inner region of the corner structure may be filled with a pattern indicating the type of material layer in which the corner structure is formed. The corner structure exhibits a strong contrast even if the wafer is subjected to a CMP treatment.