Semiconductor component
US6727586B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2002 |
| Grant date | Apr 27, 2004 |
| Priority date | — |
| Expiry date | Nov 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component that is suitable for wafer level packaging contains a plurality of contact elements that are elevated relative to a main body of the semiconductor component. Some of the contact elements are needed only for purposes of testing on the wafer level and should not be subsequently accessible from outside. For this purpose, the semiconductor component contains an insulating layer that covers the elevated contact elements that are provided for testing purposes but leaves the remaining contact elements uncovered. In this way, inadvertent activating of test functions on the chip is effectively prevented by simple measures, for instance by inserting only one additional fabrication step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.