Method and apparatus for cooling a resonator of a megasonic transducer
US6729339B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | May 4, 2004 |
| Priority date | — |
| Expiry date | Sep 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for cleaning a semiconductor substrate is provided. The method initiates with introducing a liquid onto the top surface of the semiconductor substrate. Then, a bottom surface of a resonator is coupled to a top surface of a semiconductor substrate through the liquid. Next, sonic energy is transmitted through the resonator to the liquid. Then, the liquid is heated through the bottom surface of the resonator. A method for applying localized heating to a cleaning chemistry during a cleaning operation of a semiconductor substrate is also provided. The method initiates with positioning a resonator to contact a surface of a cleaning chemistry applied to a semiconductor substrate. Then, heat energy is simultaneously applied with the sonic energy through the resonator to clean the semiconductor substrate. A device for cleaning a semiconductor substrate and system for cleaning a semiconductor substrate are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.