Pressure controlled heat source and method for using such for RTP
US6735378B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2003 |
| Grant date | May 11, 2004 |
| Priority date | — |
| Expiry date | May 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal device with a container having a surface exposed to the substrate, wherein the container further has a heat source and a plurality of thermal shields situated between the surface exposed to the substrate and the heat source. The thermal shields are spaced from one another by a predetermined distance defining one or more gaps therebetween, wherein the predetermined distance is associated with a mean free path of a gas residing therein. Alternatively, the predetermined distance is variable. A pressure of a gas residing within the one or more gaps is controlled, wherein the pressure of the gas switches the thermal conductivity of the gas between generally conductive and generally non-conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.