Method and apparatus for using tool state information to identify faulty wafers
US6738731B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2001 |
| Grant date | May 18, 2004 |
| Priority date | — |
| Expiry date | Mar 16, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for identifying faulty wafers includes processing a set of wafers in a tool; collecting tool state information during the processing of the set of wafers; generating a tool state information baseline; comparing the tool state information for each wafer to the tool state information baseline to identify any wafers with outlying tool state information; and designating a particular wafer in the set as suspect in response to identifying outlying tool state information for the particular wafer. A processing line includes a tool adapted to process a set of wafers, and a process controller. The process controller is adapted to collect tool state information during the processing of the set of wafers, generate a tool state information baseline, compare the tool state information for each wafer to the baseline tool state information to identify any wafers with outlying tool state information, and designate a particular wafer in the set as suspect in response to identifying outlying tool state information for the particular wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.