Apparatus and method for processing a microelectronic workpiece using metrology
US6747734B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2000 |
| Grant date | Jun 8, 2004 |
| Priority date | — |
| Expiry date | Nov 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a process sequence of the processing apparatus based on a feed forward or a feed back signal from the metrology unit. A seed layer deposition tool, a process layer electrochemical deposition tool, and a chemical mechanical polishing tool, arranged for sequential processing of a workpiece, can be controlled as an integrated system using one or more metrology units. A metrology unit can be located at each tool to measure workpiece parameters. Each of the metrology units can be used as a feed forward control and/or a feed back control at each of the tools.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.