Hydrolytically stable grooved polishing pads for chemical mechanical planarization
US6749485B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2000 |
| Grant date | Jun 15, 2004 |
| Priority date | — |
| Expiry date | Sep 20, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness and hydrolytic stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.