Method and apparatus for an air bearing platen with raised topography
US6752898B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An invention is provided for a CMP apparatus that enhances removal rate uniformity. The CMP apparatus includes a polishing belt disposed below a carrier head that is capable of applying a wafer to the polishing belt. Also included is a platen disposed below the polishing belt. The platen includes a circular shim section disposed on the top surface of the platen. The circular shim section is higher than the top surface of the platen. When using this configuration, increasing pressure to the backside of the polishing belt decreases the edge removal rate of the wafer. Conversely, decreasing pressure to the backside of the polishing belt increases the edge removal rate of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.