Plating bath and method for depositing a metal layer on a substrate
US6773573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2001 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Nov 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.