Method for releasable contact-connection of a plurality of integrated semiconductor modules on a wafer

US6773934B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Jens Mockel · Isny im Allgäu, DE
• Gerrit Farber · Hersbruck, DE
• Martin Fritz · Kobenz, AT
• Frank Weber · San Diego, US
• Michael Hübner · Weinheim, DE

Key dates

• Filing date: Mar 25, 2002
• Grant date: Aug 10, 2004
• Expiry date: Aug 4, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/312
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for releasable contact-connection of a plurality of integrated semiconductor modules on a wafer, each of which having a plurality of interconnected supply voltage terminals, includes the steps of providing a contacting card for applying external electrical signals to the semiconductor modules with contact elements for releasable electrical connection to terminal pads of the semiconductor modules, aligning the contacting card with the wafer, producing a releasable contact between terminal pads of the plurality of semiconductor modules and the contact elements of the contacting card, checking the contact quality for each of the semiconductor modules by applying a voltage to at least one of the supply voltage terminals of the semiconductor module through the contacting card, measuring the voltage present at a further one of the supply voltage terminals through the contacting card, and using the measurement result to assess whether or not the semiconductor module has correct contact.