Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices
US6775140B2 · kind B2 · utility
50Cited by
16References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | May 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a semiconductor device heat spreader from a unitary piece of metallic material. The metallic material is stamped to form a unitary heat spreader having an upper heat dissipation region, a lower substrate contact region, and supports connecting the upper heat dissipation region and the lower substrate contact region. A recess is formed within the supports and the upper and lower regions for receiving a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.