Semiconductor wafer and device for semiconductor device manufacturing process
US6787797B2 · kind B2 · utility
5Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2002 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Jul 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to improve the productivity or production yield of chips in the process for device fabrication, the present invention provides a wafer or an apparatus of process for fabricating semiconductor devices having the backside of the wafer or the surface of a wafer holding means adjusted so as to have a distribution in contact surface density between the surface of the wafer holding means and the backside of the wafer when the semiconductor wafer is held on the wafer holding means in the process for fabricating devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.