Fullerene coated component of semiconductor processing equipment and method of manufacturing thereof
US6790242B2 · kind B2 · utility
4Cited by
43References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2000 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Jul 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/847
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a fullerene containing surface and process for manufacturing thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.