Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
US6791194B1 · kind B1 · utility
10Cited by
14References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250° C.).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.