Reactor for processing a semiconductor wafer
US6794291B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Jul 23, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.