Apparatus for removal/remaining thickness profile manipulation
US6808442B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2001 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Mar 17, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An invention is provided for removal rate profile manipulation during a CMP process. An apparatus of the embodiments of the present invention includes an actuator capable of vertical movement perpendicular to a polishing surface of a polishing pad. The actuator is further capable of flexing the polishing pad independently of a pad support device. Also included in the apparatus is an actuator control mechanism that is in communication with the actuator. The actuator control mechanism is capable of controlling an amount of vertical movement of the actuator, allowing the actuator to provide local flexing of the polishing pad to achieve a particular removal rate profile. The actuator can also be capable of horizontal movement parallel to the polishing surface of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.