Organic packages having low tin solder connections
US6812570B2 · kind B2 · utility
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51References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Sep 1, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.