Method for separating two elements and a device therefor
US6821376B1 · kind B1 · utility
26Cited by
16References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2002 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Feb 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process and device for separating two semi-conductor substrate wafers along an interface. The process includes forming a cavity, and initiating separation by applying force to the interface through the cavity. The device utilizes fluid or gas, and pressure chambers, to subject adherent faces of the interface to at least one of chemical or mechanical action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.