Plasma processing system
US6823816B2 · kind B2 · utility
4Cited by
2References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 18, 2003 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Aug 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32192
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electromagnetic wave absorber (4) of a material that causes a large dielectric or magnetic loss is disposed so as to surround a region between a high-frequency wave transmitting window (3) and an antenna (32) to suppress the formation of a sanding wave by suppressing the reflection of microwaves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.