Semiconductor device testing apparatus and method for manufacturing the same
US6828810B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Jul 30, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0491
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device testing apparatus is realized, which allows contactors to be positioned throughout the wafer surface highly accurately for uniform contact, testing a large-sized wafer, and cost reduction. A plurality of divided contactor blocks is formed with a positioning groove. The groove is used to position the plurality of contactor blocks with a positioning frame. Because the contactor blocks are divided into plurals, it is less likely that a partial surface distortion affects other portions to impair surface flatness as compared with the case where a plurality of non-divided contactors is formed integrally, and the plurality of contactor blocks can be brought into contact with a wafer to be tested uniformly. Additionally, even though abnormality is generated in a part of the contactor blocks, only the part of the contactor blocks is replaced. Therefore, replacement costs can be reduced as compared with the case where a plurality of non-divided contactors is formed integrally.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.