Structure and method of forming a multiple leadframe semiconductor device
US6833290B2 · kind B2 · utility
8Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2003 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Feb 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device (20) has a first leadframe (200) with a first semiconductor die (70) electrically coupled to one of its leads. A second semiconductor die (130) is mounted to a second leadframe (300) that has a first lead (35, 150) electrically coupled to the second semiconductor die and a second lead (30, 35) mounted to the lead of the first leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.