Spray cooling and transparent cooling plate thermal management system
US6836131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2003 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Apr 16, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A combination cooling plate and micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes a transparent heat spreader and micro-spray heads disposed about the heat spreader. The spray heads spray cooling liquid onto a periphery of said heat spreader so as to remove heat from the chip. Alternatively, and micro-spray heads are provided inside the cooling plate holder so as to spray cooling liquid inside the interior of the holder so that the holder is cooled. The holder is in physical contact with the heat spreader, so that as the holder is cooled by the spray, heat is removed from the heat spreader, and thereby from the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.