Nader Pakdaman
20Patents
14h-index
12Co-inventors
70Inventor score
Filing activity: Nov 28, 2001 → Jun 1, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7256055B2 | System and apparatus for using test structures inside of a chip during the fabrication of the chip | Electricity | 108 | Expired |
| US7736916B2 | System and apparatus for using test structures inside of a chip during the fabrication of the chip | Electricity | 93 | Active |
| US8344745B2 | Test structures for evaluating a fabrication of a die or a wafer | Electricity | 88 | Active |
| US6621275B2 | Time resolved non-invasive diagnostics system | Physics | 68 | Expired |
| US8990759B2 | Contactless technique for evaluating a fabrication of a wafer | Electricity | 59 | Active |
| US6859031B2 | Apparatus and method for dynamic diagnostic testing of integrated circuits | Physics | 44 | Expired |
| US6594086B1 | Bi-convex solid immersion lens | Physics | 33 | Expired |
| US6836131B2 | Spray cooling and transparent cooling plate thermal management system | Physics | 33 | Expired |
| US7220990B2 | Technique for evaluating a fabrication of a die and wafer | Electricity | 30 | Expired |
| US6778327B2 | Bi-convex solid immersion lens | Physics | 20 | Expired |
| US7224828B2 | Time resolved non-invasive diagnostics system | Physics | 19 | Expired |
| US7423288B2 | Technique for evaluating a fabrication of a die and wafer | Electricity | 14 | Active |
| US7605597B2 | Intra-chip power and test signal generation for use with test structures on wafers | Electricity | 14 | Active |
| US7730434B2 | Contactless technique for evaluating a fabrication of a wafer | Electricity | 14 | Active |
| US7339388B2 | Intra-clip power and test signal generation for use with test structures on wafers | Electricity | 11 | Expired |
| US7492529B2 | Bi-convex solid immersion lens | Physics | 8 | Active |
| US7227702B2 | Bi-convex solid immersion lens | Physics | 6 | Expired |
| US7466852B2 | Time resolved non-invasive diagnostics system | Physics | 5 | Active |
| US8410568B2 | Integrated photodiode for semiconductor substrates | Electricity | 3 | Active |
| US7723724B2 | System for using test structures to evaluate a fabrication of a wafer | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.