Patent · US Expired

Method for connection of circuit units

US6845554B2 · kind B2 · utility

96Cited by

5References

7Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gerd Frankowsky · Wappingers Falls, US
Harry Hedler · Germering, DE
Roland Irsigler · Munich, DE
Thorsten Meyer · Regensburg, DE
Barbara Vasquez · Austin, US

Key dates

Filing date	Nov 18, 2002
Grant date	Jan 25, 2005
Priority date	—
Expiry date	Dec 25, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53178
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.