Device having resin package and method of producing the same
US6856017B2 · kind B2 · utility
7Cited by
16References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1999 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Jan 25, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.