Semiconductor device having aluminum alloy conductors
US6856021B1 · kind B1 · utility
2Cited by
10References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2000 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Nov 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided which includes a semiconductor substrate, metal conductors formed on a side of a main face of the substrate, which metal conductors contain aluminum as a main constituent thereof, and copper as an additive element, the metal conductors being made to contain such an element as to suppress the precipitation of copper or being made to have such a film adjacent to the metal conductor as to suppress the precipitation of copper or being made to have such a film adjacent to the metal conductor as to suppress the precipitation of copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.