Mold structure for package fabrication
US6857865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2002 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Nov 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold has a recessed cavity for receiving the fixture therein, and adapted to be engaged with the top mold, wherein a resilient member is disposed on an inner wall of the recessed cavity, and interposed between the fixture and the recessed cavity of the bottom mold, allowing the resilient member to provide a resilient force for properly positioning the fixture. By using the above mold structure, chips mounted on a substrate can be firmly supported in the mold structure without causing chip cracks during a molding process for encapsulating the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.