Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles
US6858116B2 · kind B2 · utility
23Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2001 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Oct 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3435
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sputtering target producing few particles, a backing plate or a sputtering apparatus, and a sputtering method producing few particles. An arc-spraying coating film and a plasma-spraying coating film over the former are formed on the sputtering target, a backing plate, or another surface in the sputtering apparatus, where an unwanted film might be formed. Thus a deposit is prevent from separating/flying from the target, backing plate, or another surface where an unwanted film might be formed in the sputtering apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.