Bump and fabricating process thereof
US6864168B2 · kind B2 · utility
16Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2003 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Aug 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 μm is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.