Semiconductor interconnect and method of providing interconnect using a contact region
US6864582B1 · kind B1 · utility
1Cited by
1References
4Claims
0Family size
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Key dates
| Filing date | Oct 31, 2002 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Jan 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor structure, interconnects between regions of a single device or different devices are achieved by forming contacts or plugs in thick oxide holes that span across the regions to be interconnected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.