Inventor · Sunnyvale, CA, US

Peter Johnson

90Patents
16h-index
54Co-inventors
87Inventor score

Filing activity: Aug 26, 1974 → Aug 16, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US8222065B1 Method and system for forming a capacitive micromachined ultrasonic transducer Electricity 81 Active
US7046687B1 Configurable virtual output queues in a scalable switching system Electricity 71 Expired
US8563345B2 Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements Electricity 65 Active
US6275919A Memory storage and retrieval with multiple hashing functions Physics 54 Expired
US8324006B1 Method of forming a capacitive micromachined ultrasonic transducer (CMUT) Performing Operations; Transporting 40 Active
US7250842B1 MEMS inductor with very low resistance Electricity 38 Expired
US7268410B1 Integrated switching voltage regulator using copper process technology Electricity 35 Expired
US8101479B2 Fabrication of asymmetric field-effect transistors using L-shaped spacers Electricity 29 Active
US7875955B1 On-chip power inductor Electricity 23 Active
US7902661B2 Integrated circuit micro-module Electricity 23 Active
US6964907B1 Method of etching a lateral trench under an extrinsic base and improved bipolar transistor Electricity 22 Expired
US7463131B1 Patterned magnetic layer on-chip inductor Electricity 21 Expired
US7843056B2 Integrated circuit micro-module Electricity 19 Active
US3935818A Combined fuze and guidance system for a missile Physics 17 Expired
US7132342B1 Method of reducing fringing capacitance in a MOSFET Electricity 17 Expired
US7633373B1 Thin film resistor and method of forming the resistor on spaced-apart conductive pads Electricity 16 Active
US7157891B1 DC-DC voltage converter with reduced output voltage ripple Electricity 15 Expired
US7468899B1 Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits Emerging Cross-Sectional Technologies 15 Active
US7005388B1 Method of forming through-the-wafer metal interconnect structures Electricity 14 Expired
US8378776B1 Semiconductor structure with galvanically-isolated signal and power paths Electricity 14 Active
US7119431B1 Apparatus and method for forming heat sinks on silicon on insulator wafers Electricity 14 Expired
US8044755B2 MEMS power inductor Emerging Cross-Sectional Technologies 13 Active
US7755463B2 Integrated circuits with inductors Emerging Cross-Sectional Technologies 13 Active
US8674418B2 Method and apparatus for achieving galvanic isolation in package having integral isolation medium Electricity 12 Active
US7301436B1 Apparatus and method for precision trimming of integrated circuits using anti-fuse bond pads Electricity 12 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.