Universal package for an electronic component with a semiconductor chip and method for producing the universal package

US6867471B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Bernd Goller · Otterfing, DE
• Robert-Christian Hagen · Sarching, DE
• Gerald Ofner · Regensburg, DE
• Christian Stuempfl · Schmidgaden, DE
• Stefan Wein · Regensburg, DE
• Holger Wörner · Regensburg, DE

Key dates

• Filing date: Aug 29, 2003
• Grant date: Mar 15, 2005
• Expiry date: Sep 7, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/351
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.