Indirect stimulation of an integrated circuit die
US6870379B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2002 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Jun 6, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Analysis of a semiconductor die is enhanced by the stimulation the die and the detection of a response to the stimulation. According to an example embodiment of the present invention, a semiconductor die is analyzed using indirect stimulation of a portion of the die, and detecting a response therefrom. First, selected portion of circuitry within the die is stimulated. The stimulation of the selected portion induces a second portion of circuitry within the die to generate an external emission. The emission is detected and the die is analyzed therefrom. In one particular implementation, a response from the selected portion is inhibited from interfering with the detection of the emission from the second portion of circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.