Patent · US Expired

Temperature control sequence of electroless plating baths

US6875691B2 · kind B2 · utility

7Cited by
34References
34Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 21, 2002
Grant dateApr 5, 2005
Priority date—
Expiry dateFeb 7, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/288
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A sequence of temperature control in electroless plating for microelectronic processing is disclosed in this invention. This sequence improves the uniformity of the deposit, increases the lifetime of the plating bath and is cost effective. The plating bath is heated to a temperature, which is lower than the minimum deposition temperature, in an apparatus outside the plating chamber. Then the solution is introduced into the plating chamber without the occurrence of the deposition. After the chamber is filled, the solution is heated up to the desired deposition temperature. The deposition is initialized. After the deposition, the solution is returned back to the original tank.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.