Diffuser with spiral opening pattern for electroplating reactor vessel
US6881309B2 · kind B2 · utility
1Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2001 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Sep 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.