Method and apparatus for scanning semiconductor wafers using a scanning electron microscope
US6881956B1 · kind B1 · utility
4Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Aug 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for scanning the surface of a specimen is disclosed for defect inspection purposes. Scanning Electron Microscope (SEM) is used to scan the surface of a specimen. The scanning method employed by the SEM comprises the steps of: generating a particle beam from a particle beam emitter, and scanning the surface of the specimen by bending the particle beam at an angle with respect to the surface of the specimen, wherein the particle beam traverses an angle that is not parallel or perpendicular to the orientation of the specimen. The specimen being scanned is a semiconductor wafer or a photomask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.