Cladded conductor for use in a magnetoelectronics device and method for fabricating the same
US6885074B2 · kind B2 · utility
8Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2002 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Nov 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a cladded conductor (42) for use in a magnetoelectronics device is provided. The method includes providing a substrate (10) and forming a conductive barrier layer (12) overlying the substrate (10). A dielectric layer (16) is formed overlying the conductive barrier layer (12) and a conducting line (20) is formed within a portion of the dielectric layer (16). The dielectric layer (16) is removed and a flux concentrator (30) is formed overlying the conducting line (20).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.