Patent · US Expired

Method for making an integrated circuit package having reduced bow

US6887740B2 · kind B2 · utility

2Cited by

12References

21Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

William Tandy · Boise, US
Matt E. Schwab · Boise, US
Cary J. Baerlocher · Meridian, US

Key dates

Filing date	Apr 10, 2003
Grant date	May 3, 2005
Priority date	—
Expiry date	Apr 10, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.